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Introduction

Welcome to our comprehensive This user manual designed is intended to assist you in board-designers who consider developing a custom NIO board for use with our cutting-edge System on Module (SoM), which incorporates one of several high-performance AMD Ryzen™ processors. This manual is tailored specifically for hardware engineers looking to leverage the robust capabilities of the following AMD Ryzen™ processor models in their designs:

• AMD Ryzen™ 7 Pro 8845HS New

• AMD Ryzen™ 7 Pro 8840U New

Ryzen Embedded 8000 Series - Product Stack

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Our SoM offers a versatile foundation for a wide array of applications, from complex industrial PCs to sophisticated multimedia systems. By selecting our module, you will benefit from the remarkable performance, efficiency, and integrated features of AMD Ryzen™ processors, coupled with the flexibility and scalability essential for modern electronic design.

This manual will guide you through the key aspects of integrating our SoM into your custom NIO design. It covers essential design considerations, including power for SolidRun Bedrock SOM.

Bedrock SOM

Bedrock SOM is a system-on-module based on AMD Ryzen Embedded / Mobile processors with FP7R2 footprint. It is a compact self-contained computer system with processing, RAM, storage, power regulation and cooling. It brings out only the native I/O of the processor through high density board-to-board connectors to allow highly-modular system design with a high-degree of system customization by extension boards.

Currently Bedrock SOM is offered with several Ryzen variants including

• Ryzen Embedded V3000 series

• Ryzen Embedded 8000 series (“Hawk Point”)

• Ryzen 7000 series (“Phoenix”)

To learn about the unique properties of each processor please review the corresponding Bedrock PC documentation.

NIO - Networking & I/O Extension Board

NIO stands for Networking & I/O. NIO extension board is connected directly to Bedrock SOM.

SolidRun offers several types of NIO boards. NIO design files are offered as reference for board-designers who considering developing custom NIO boards.

About this User Manual

This manual will guide you through the key aspects of integrating Bedrock SOM into your custom NIO design. It covers essential design considerations, including power requirements, signal integrity, thermal management, and connectivity options, ensuring you can fully harness the power of the AMD Ryzen™ processor in your specific application.

Each section of this manual provides detailed information and technical specifications to help you understand the interfaces, pinouts, and schematic design principles necessary for successful integration. Additionally, we provide best practices and expert tips to mitigate common design challenges and optimize your development process.

We encourage you to use this manual as a resource for your design journey, enabling you to create innovative and effective solutions that leverage our powerful and flexible SoM platform. Whether you are designing for demanding industrial environments or for consumer electronics, this manual is your gateway to developing a successful product with our System on Module.

Thank you for choosing our technology. We look forward to seeing the exceptional solutions you will build.

Bedrock SOM Block Diagram

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Feature Summary:

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Bedrock SOM Block Diagram

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Feature Summary:

• Memory: DDR5 Dual 64BG Channels, Support Up to DDR5-5600.

• USB:
  2x USB4 (40 Gbps) - Supports USB-C Alt-Mode.
  2x USB 3.2 Gen2 (10 Gbps).
  4x USB2.0

• Display:
  • DisplayPort 0 (DP0) : eDP/DP/HDMI
  • DisplayPort 1 (DP1) : eDP/DP/HDMI
  • DisplayPort 2 (DP2, USBC0) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 3 (DP3, USBC1) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 4 (DP4, USBC4) : DP/HDMI; or USB-C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

AMD Ryzen™ 8040 Series Processors

We are excited to announce that AMD has recently launched the new Ryzen™ 8040 Series processors, representing the latest advancement in their mobile PC processor technology. As a pioneer in the industry, SolidRun is proud to be the first to integrate this cutting-edge processor series into a fanless industrial PC. This milestone underscores our commitment to leading the market by adopting innovative technologies that enhance the performance and reliability of our products.

Introduction to the Ryzen™ 8040 Series

The Ryzen™ 8040 Series processors build upon the foundation set by the previous 7040 Series, introducing several key enhancements that significantly improve performance, power efficiency, and connectivity. Based on the latest AMD technology, this series is designed to meet the demanding needs of modern applications, from enhanced multimedia capabilities to robust enterprise solutions.

Key Features of the Ryzen™ 8040 Series

1. AI Processing Power: The 8040 Series features an integrated Neural Processing Unit (NPU) on select models which offers up to 1.6 times more AI processing performance compared to the previous models. This enhancement enables larger AI model handling directly on the device, facilitating more complex and real-time AI user experiences​.

2. Processor Architecture and Performance: Built on the AMD "Zen 4" architecture, the 8040 Series processors can have up to eight cores, capable of delivering up to 16 threads of processing power. Notable models like the Ryzen 9 8945HS provide significantly enhanced performance metrics—up to 64% faster video editing and up to 37% faster 3D rendering compared to competitors. These processors also feature advanced RDNA 3 architecture-based Radeon graphics for superior gaming and creative performance​.

3. Power Efficiency and Support for Advanced Memory: The 8040 Series supports advanced LPDDR5 memory, which contributes to its ability to manage high-demand applications more efficiently while also ensuring longer battery life through innovative power management features. This is especially beneficial for ultrathin laptops where power efficiency is crucial​.

4. Enhanced Connectivity and Features: These processors are designed to leverage the full range of the Windows 11 ecosystem for optimized performance, including comprehensive support for the latest security features and AI-enhanced applications provided by Windows. Features like background blur, eye gaze tracking, and noise cancellation are now accessible out-of-the-box on systems with these processors.

5. Software Ecosystem and Developer Support: AMD has also introduced Ryzen AI 1.0 Software alongside the 8040 Series. This software stack makes it easier for developers to deploy machine learning models trained in frameworks like PyTorch or TensorFlow, which can run efficiently on these processors​.

Mechanical Files

SoM Board Dimensions: 83 x 75.76 mm (Top View):

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Mechanical Files Download Links:

Bedrock SOM - Assembly Files.zip
Bedrock SOM - Mechanical Files.zip

Bedrock R7000 Basic Block Diagram

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Bedrock Cartridge

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• -C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

Mechanical Files

SoM Board Dimensions: 83 x 75.76 mm (Top View):

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Mechanical Files Download Links:

Bedrock SOM - Assembly Files.zip
Bedrock SOM - Mechanical Files.zip

Typical Block Diagram of a complete system

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Bedrock Cartridge

As part of developing a custom extension board for the Bedrock SOM, it’s recommended to use Bedrock Cartridge.

Bedrock Cartridge provides the following:

• Highly effective 1st stage thermal coupling (TIM0) to the Ryzen die to a copper heatplate.
  Coupling the heatplate to a heatsink/cold-plate is easy. Coupling the die is challenging.

• Provision for mounting NIO securely with accurate spacing.

• Easy mounting of SOM to enclosure / heatsink / cold-plate.

• Thermal coupling for SOM’s DC-to-DC converters

• Mounting of NVME SSD
  Not present on SOM itself

• Securing and thermal coupling for SODIMMs

• RTC battery compartment

• Physical protection and rigidity to the SOM

• Rigid chassis for the Bedrock Deck with multiple threaded mounting holes

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SOM Board-to-Board Connectors - MFG P/N

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Note: Top Side of SoM is placed on Top Side of NIO, where the two boards are flipped one towards the other.

Board-to-board Connectors Pin-out

The following is an example of the B2B pinout in NIO.
Please note that the pinout relates to the female connectors on a carrier, to which the Bedrock SoM male Connectors are inserted, and here we gave an example for SolidRun NIO Connectors (J4, J5, J6, J7). It’s important to be careful which pin is number #1.

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OrCad Symbols

In the following link you will find a PDF and OrCad Symbols for the NIO board-to-board connectors, to which the SoM (Male) Connectors are inserted: 

1. NIO BtB Connectors - PDF

2. NIO BtB Connectors - OrCad Symbols

Differential Signals Impedance

In this Excel, you will find a list for the impedance for each differential signal. 

Note: All differential pairs are 90-Ohm, the rest are GPIOs/Single-Ended signals which are 50-Ohm by default.

Thermal Dissipation

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Thermal grease on Cartrridge:
We apply thermal grease on certain spots in the Cartridge in order to cool down certain parts on the SoM, such as Inductors and ICs. we recommend placing the thermal grease (white) in the following places:

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Thermal paste on HeatSink and Thermal Pad on NVME:

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-Ohm by default.

Thermal coupling

First stage thermal coupling in cartridge

The cartridge is assembled in the factory and should not be disassembled. It provides 1st stage cooling for the processor and power FETs.

2nd stage thermal coupling (heatplate, NVME, RAM, cartridge)

• Thermal grease should be applied on heatplate. Heatplate should be attached to a cold plate.

• Thermal pad should be applied on NVME

• If device is intended to work at high ambient temperature it is advised to apply thermal gel between SODIMMs and RAM cover and thermal grease on top side of RAM cover

• The frame of the skirt is thermally coupled to the cold plate. Consider applying thermal paste on the frame of the skirt.

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Power Consumption

SmartShift Technology for Optimized Power Management

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Power Input

The recommended input range for the SoM is 12V-24V.

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SolidRun uses Molex 1053071202 Connector to interface between the SoM power input and the Phoenix Connecter.

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Flashing BIOS and MPS Power Controller
(Soon)