Introduction

Welcome to our comprehensive user manual designed to assist you in developing a custom carrier board for use with our cutting-edge System on Module (SoM), which incorporates one of several high-performance AMD Ryzen™ processors. This manual is tailored specifically for hardware engineers looking to leverage the robust capabilities of the following AMD Ryzen™ processor models in their designs:

• AMD Ryzen™ 7 7840HS

• AMD Ryzen™ 7 7840U

• AMD Ryzen™ 3 7440U

• AMD Ryzen™ 7 8845HS (Soon)

Our SoM offers a versatile foundation for a wide array of applications, from complex industrial PCs to sophisticated multimedia systems. By selecting our module, you will benefit from the remarkable performance, efficiency, and integrated features of AMD Ryzen™ processors, coupled with the flexibility and scalability essential for modern electronic design.

This manual will guide you through the key aspects of integrating our SoM into your custom carrier board design. It covers essential design considerations, including power requirements, signal integrity, thermal management, and connectivity options, ensuring you can fully harness the power of the AMD Ryzen™ processor in your specific application.

Each section of this manual provides detailed information and technical specifications to help you understand the interfaces, pinouts, and schematic design principles necessary for successful integration. Additionally, we provide best practices and expert tips to mitigate common design challenges and optimize your development process.

We encourage you to use this manual as a resource for your design journey, enabling you to create innovative and effective solutions that leverage our powerful and flexible SoM platform. Whether you are designing for demanding industrial environments or for consumer electronics, this manual is your gateway to developing a successful product with our System on Module.

Thank you for choosing our technology. We look forward to seeing the exceptional solutions you will build.

Features Summary

• Memory: DDR5 Dual 64BG Channels, Support Up to DDR5-5600.

• USB:
  2x USB4 (40 Gbps) - Supports USB-C Alt-Mode.
  2x USB 3.2 Gen2 (10 Gbps).
  4x USB2.0

• Display:
  • DisplayPort 0 (DP0) : eDP/DP/HDMI
  • DisplayPort 1 (DP1) : eDP/DP/HDMI
  • DisplayPort 2 (DP2, USBC0) : DP/HDMI; or USB-C® with DP alt mode; or USB4
  • DisplayPort 3 (DP3, USBC1): DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 4 (DP4, USBC4) : DP/HDMI; or USB-C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

Mechanical Files

SoM Board Dimensions: 83 x 75.76 mm (Top View):

Mechanical Files Download Links:

Bedrock R7K/R8K SoM - Assembly Files.zip
Bedrock R7K/R8K SoM - Mechanical Files.zip

Carrier Board Example - Bedrock R7000/R8000

Bedrock Cartridge

The Block Diagram above relates to SolidRun Bedrock R7000 Carrier Board which is called NIO (Networking and I/O board).

As part of developing a Custom Carrier board for the Bedrock  SoM, it’s recommended to take a look at the Bedrock Cartridge which is designed and used in our Bedrock R7000 product.

HeatPlate Screws

In addition to our advanced thermal solutions, we are excited to offer a proprietary development in hardware assembly — specialized nuts (SolidRun P/N: MCH00462) designed specifically for securing the heatplate to the CPU in our System on Module (SoM). These nuts have been engineered for optimal thermal contact and mechanical stability, ensuring that the heatplate remains effectively and securely attached, enhancing overall thermal management. We make these specialized screws available for purchase alongside our SoM, providing a comprehensive solution for high-performance and reliability.

Back view: 

Same four nuts also can be inserted through the cartridge:

Note: Phillips #0 cross screwdriver is needed for this type of nuts.

Side view of the heat-plate + 4 nuts (MCH00462): 

Carrier B-t-B Connectors - MFG P/N

Bedrock SoM Connectors (Males):

Bedrock Carrier (NIO) Connectors (Females):

Note: Top Side of SoM is placed on Top Side of NIO (Carrier), where the two boards are flipped one towards the other.

B-t-B Connectors - Example with Bedrock R7K Carrier (NIO)

Please note that the pinout relates to the female connectors on a carrier, to which the Bedrock SoM male Connectors are inserted, and here we gave an example for SolidRun NIO Carrier Connectors (J4, J5, J6, J7). It’s important to be careful which pin is number #1.

OrCad Symbols

In the following link you will find a PDF and OrCad Symbols for the Carrier BtB (Female) connectors, to which the SoM (Male) Connectors are inserted: 

1. Carrier BtB Connectors - PDF

2. Carrier BtB Connectors - OrCad Symbols

Differential Signals Impedance

In this Excel, you will find a list for the impedance for each differential signal. 

Note: All differential pairs are 90-Ohm, the rest are GPIOs/Single-Ended signals which are 50-Ohm by default.

Thermal Dissipation

• Thermal Pads:
  TBD

• Liquid Metal:
  In SolidRun’s continuous efforts to optimize the performance and reliability of our System on Module (SoM), we have integrated an advanced thermal management solution. This feature employs a specialized liquid metal compound applied directly to the CPU, significantly enhancing thermal dissipation efficiency. While the specifics of this liquid metal technology are proprietary and cannot be disclosed publicly, we are pleased to offer it as a standard part of our SoM. This approach ensures that our customers benefit from reduced thermal constraints and improved performance without the need for separate implementation or additional thermal management strategies.

Power Consumption

SmartShift Technology for Optimized Power Management

One of the key features of our System on Module, integrated with AMD Ryzen™ processors, is the SmartShift technology. This innovative feature allows for dynamic adjustment of power allocation between the CPU and other system components. By intelligently shifting power where it's needed most, SmartShift enhances overall performance and efficiency, making it an ideal solution for power-sensitive applications.

Controlling CPU Power Consumption

With SmartShift, you can precisely control the power consumption of the CPU, tailoring it to fit the specific needs of your application. This capability is especially beneficial in scenarios where power efficiency is crucial, such as in portable or battery-operated devices. You can set a limit to the CPU power consumption, for example, capping it at a specific wattage to balance performance with power usage.

Configuring CPU Power Limits in BIOS

To configure the CPU power limits, you can access the BIOS settings of our System on Module. We provide a detailed guide on how to navigate these settings and effectively set the desired power caps for your application.

For step-by-step instructions on accessing and modifying these settings, please visit our detailed BIOS configuration page here: Bedrock V3000 BIOS Settings - Power Screen.

By leveraging the SmartShift technology and configuring your CPU power settings via BIOS, you can optimize your system’s performance and power consumption, leading to a more efficient and tailored usage according to your specific requirements. This section of the manual ensures that you have all the necessary tools and knowledge to take full advantage of the innovative features provided by our System on Module.

Power Input

The recommended input range for the SoM is 12V-24V.
Note: there is no reverse polarity protection on the SoM, please be careful not to confuse between the “+” and “-” signs. (Red is Positive “+”, Black is Negative “-”)

SolidRun uses Molex 1053071202 Connector to interface between the SoM power input and the Phoenix Connecter.

Interface Allocation Spreadsheet

Make a copy of Bedrock Interface Allocation Spreadsheet and see an actual example of Bedrock SoM Interfaces.
The specific implementation in the spreadsheet relates to the Bedrock R7000 Basic product.
Feel free to add/delete columns in order to match the implementation to your own custom carrier board.