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Date

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Owner

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Revision

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Notes

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01 May 2024

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Firas Abd El Gani

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1.0

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Table of Contents

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Introduction

Welcome to our comprehensive user manual designed to assist you in developing a custom carrier board for use with our cutting-edge System on Module (SoM), which incorporates one of several high-performance AMD Ryzen™ processors. This manual is tailored specifically for hardware engineers looking to leverage the robust capabilities of the following AMD Ryzen™ processor models in their designs:

• AMD Ryzen™ 7 Pro 8845HS New

• AMD Ryzen™ 7 Pro 8840U New

Ryzen Embedded 8000 Series - Product Stack

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Our SoM offers a versatile foundation for a wide array of applications, from complex industrial PCs to sophisticated multimedia systems. By selecting our module, you will benefit from the remarkable performance, efficiency, and integrated features of AMD Ryzen™ processors, coupled with the flexibility and scalability essential for modern electronic design.

This manual will guide you through the key aspects of integrating our SoM into your custom carrier board design. It covers essential design considerations, including power requirements, signal integrity, thermal management, and connectivity options, ensuring you can fully harness the power of the AMD Ryzen™ processor in your specific application.

Each section of this manual provides detailed information and technical specifications to help you understand the interfaces, pinouts, and schematic design principles necessary for successful integration. Additionally, we provide best practices and expert tips to mitigate common design challenges and optimize your development process.

We encourage you to use this manual as a resource for your design journey, enabling you to create innovative and effective solutions that leverage our powerful and flexible SoM platform. Whether you are designing for demanding industrial environments or for consumer electronics, this manual is your gateway to developing a successful product with our System on Module.

Thank you for choosing our technology. We look forward to seeing the exceptional solutions you will build.

SOM R7000 / SOM R8000 - Block Diagram

Image Removed

Feature Summary:

• Memory: DDR5 Dual 64BG Channels, Support Up to DDR5-5600.

• USB:
  2x USB4 (40 Gbps) - Supports USB-C Alt-Mode.
  2x USB 3.2 Gen2 (10 Gbps).
  4x USB2.0

• Display:
  • DisplayPort 0 (DP0) : eDP/DP/HDMI
  • DisplayPort 1 (DP1) : eDP/DP/HDMI
  • DisplayPort 2 (DP2, USBC0) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 3 (DP3, USBC1) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 4 (DP4, USBC4) : DP/HDMI; or USB-C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

AMD Ryzen™ 8040 Series Processors

We are excited to announce that AMD has recently launched the new Ryzen™ 8040 Series processors, representing the latest advancement in their mobile PC processor technology. As a pioneer in the industry, SolidRun is proud to be the first to integrate this cutting-edge processor series into a fanless industrial PC. This milestone underscores our commitment to leading the market by adopting innovative technologies that enhance the performance and reliability of our products.

Introduction to the Ryzen™ 8040 Series

The Ryzen™ 8040 Series processors build upon the foundation set by the previous 7040 Series, introducing several key enhancements that significantly improve performance, power efficiency, and connectivity. Based on the latest AMD technology, this series is designed to meet the demanding needs of modern applications, from enhanced multimedia capabilities to robust enterprise solutions.

Key Features of the Ryzen™ 8040 Series

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AI Processing Power: The 8040 Series features an integrated Neural Processing Unit (NPU) on select models which offers up to 1.6 times more AI processing performance compared to the previous models. This enhancement enables larger AI model handling directly on the device, facilitating more complex and real-time AI user experiences​.

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Processor Architecture and Performance: Built on the AMD "Zen 4" architecture, the 8040 Series processors can have up to eight cores, capable of delivering up to 16 threads of processing power. Notable models like the Ryzen 9 8945HS provide significantly enhanced performance metrics—up to 64% faster video editing and up to 37% faster 3D rendering compared to competitors. These processors also feature advanced RDNA 3 architecture-based Radeon graphics for superior gaming and creative performance​.

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Power Efficiency and Support for Advanced Memory: The 8040 Series supports advanced LPDDR5 memory, which contributes to its ability to manage high-demand applications more efficiently while also ensuring longer battery life through innovative power management features. This is especially beneficial for ultrathin laptops where power efficiency is crucial​.

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Enhanced Connectivity and Features: These processors are designed to leverage the full range of the Windows 11 ecosystem for optimized performance, including comprehensive support for the latest security features and AI-enhanced applications provided by Windows. Features like background blur, eye gaze tracking, and noise cancellation are now accessible out-of-the-box on systems with these processors.

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Introduction

This user manual is intended to assist board-designers who consider developing a custom NIO for SolidRun Bedrock SOM.

Bedrock SOM

Bedrock SOM is a system-on-module based on AMD Ryzen Embedded / Mobile processors with FP7R2 footprint. It is a compact self-contained computer system with processing, RAM, storage, power regulation and cooling. It brings out only the native I/O of the processor through high density board-to-board connectors to allow highly-modular system design with a high-degree of system customization by extension boards.

Currently Bedrock SOM is offered with several Ryzen variants including

• Ryzen Embedded V3000 series

• Ryzen Embedded 8000 series (“Hawk Point”)

• Ryzen 7000 series (“Phoenix”)

To learn about the unique properties of each processor please review the corresponding Bedrock PC documentation.

NIO - Networking & I/O Extension Board

NIO stands for Networking & I/O. NIO extension board is connected directly to Bedrock SOM.

SolidRun offers several types of NIO boards. NIO design files are offered as reference for board-designers who considering developing custom NIO boards.

About this User Manual

This manual will guide you through the key aspects of integrating Bedrock SOM into your custom NIO design. It covers essential design considerations, including power requirements, signal integrity, thermal management, and connectivity options, ensuring you can fully harness the power of the AMD Ryzen™ processor in your specific application.

Each section of this manual provides detailed information and technical specifications to help you understand the interfaces, pinouts, and schematic design principles necessary for successful integration. Additionally, we provide best practices and expert tips to mitigate common design challenges and optimize your development process.

Bedrock SOM Block Diagram

Image Added

Feature Summary:

• Memory: DDR5 Dual 64BG Channels, Support Up to DDR5-5600.

• USB:
  2x USB4 (40 Gbps) - Supports USB-C Alt-Mode.
  2x USB 3.2 Gen2 (10 Gbps).
  4x USB2.0

• Display:
  • DisplayPort 0 (DP0) : eDP/DP/HDMI
  • DisplayPort 1 (DP1) : eDP/DP/HDMI
  • DisplayPort 2 (DP2, USBC0) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 3 (DP3, USBC1) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 4 (DP4, USBC4) : DP/HDMI; or USB-C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

Mechanical Files

SoM Board Dimensions: 83 x 75.76 mm (Top View):

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Mechanical Files Download LinksLink:
Bedrock R7K/R8K SoM - Assembly Files.zip
Bedrock R7K/R8K SoM SOM - Mechanical Files.zip

Carrier Board Example - Bedrock R7000

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Bedrock Cartridge

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Typical Block Diagram of a complete system

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Bedrock Cartridge

As part of developing a Custom Carrier custom extension board for the Bedrock  SoMBedrock SOM, it’s recommended to take a look at the use Bedrock Cartridge which is designed and used in our Bedrock R7000 product.

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HeatPlate Screws

In addition to our advanced thermal solutions, we are excited to offer a proprietary development in hardware assembly — specialized nuts (SolidRun P/N: MCH00462) designed specifically for securing the heatplate to the CPU in our System on Module (SoM). These nuts have been engineered for optimal thermal contact and mechanical stability, ensuring that the heatplate remains effectively and securely attached, enhancing overall thermal management. We make these specialized screws available for purchase alongside our SoM, providing a comprehensive solution for high-performance and reliability.

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Back view: 

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Same four nuts also can be inserted through the cartridge:

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Note: Phillips #0 cross screwdriver is needed for this type of nuts.

Side view of the heat-plate + 4 nuts (MCH00462): 

Image Removed

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Bedrock Cartridge provides the following:

• Highly effective 1st stage thermal coupling (TIM0) to the Ryzen die to a copper heatplate.
  Coupling the heatplate to a heatsink/cold-plate is easy. Coupling the die is challenging.

• Provision for mounting NIO securely with accurate spacing.

• Easy mounting of SOM to enclosure / heatsink / cold-plate.

• Thermal coupling for SOM’s DC-to-DC converters

• Mounting of NVME SSD
  Not present on SOM itself

• Securing and thermal coupling for SODIMMs

• RTC battery compartment

• Physical protection and rigidity to the SOM

• Rigid chassis for the Bedrock Deck with multiple threaded mounting holes

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SOM Board-to-Board Connectors - MFG P/N

Bedrock SoM Connectors (Males):

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Bedrock Carrier (NIO ) Connectors (Females):

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Note: Top Side of SoM is placed on Top Side of NIO (Carrier), where the two boards are flipped one towards the other.

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Board-

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to-

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board Connectors Pin-out

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The following is an example of the B2B pinout in Bedrock R7000 CarrierNIO.
Please note that the pinout relates to the female connectors on a carrier, to which the Bedrock SoM male Connectors are inserted, and here we gave an example for SolidRun NIO Carrier Connectors (J4, J5, J6, J7). It’s important to be careful which pin is number #1.

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NIO R7000 Basic pinout

OrCad Symbols

In the following link you will find a PDF and OrCad Symbols for the Carrier BtB (Female) NIO board-to-board connectors, to which the SoM (Male) Connectors are inserted: 

1. Carrier NIO BtB Connectors - PDF

2. Carrier NIO BtB Connectors - OrCad Symbols

Differential Signals Impedance

In this Excel, you will find a list for the impedance for each differential signal. 

Note: All differential pairs are 90-Ohm, the rest are GPIOs/Single-Ended signals which are 50-Ohm by default.

Thermal

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Thermal grease on Cartrridge:
We apply thermal grease on certain spots in the Cartridge in order to cool down certain parts on the SoM, such as Inductors and ICs. we recommend placing the thermal grease (white) in the following places:

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Thermal paste on HeatSink and Thermal Pad on NVME:

The following bottom view of the SoM shows the recommended places for placing thermal paste (on the SoM’s heatsink (gray), in addition to thermal pad on the NVME (blue):

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Liquid Metal:
In SolidRun’s continuous efforts to optimize the performance and reliability of our System on Module (SoM), we have integrated an advanced thermal management solution. This feature employs a specialized liquid metal compound applied directly to the CPU, significantly enhancing thermal dissipation efficiency. While the specifics of this liquid metal technology are proprietary and cannot be disclosed publicly, we are pleased to offer it as a standard part of our SoM. This approach ensures that our customers benefit from reduced thermal constraints and improved performance without the need for separate implementation or additional thermal management strategies.

coupling

First stage thermal coupling in cartridge

The cartridge is assembled in the factory and should not be disassembled. It provides 1st stage cooling for the processor and power FETs.

2nd stage thermal coupling (heatplate, NVME, RAM, cartridge)

• Thermal grease should be applied on heatplate. Heatplate should be attached to a cold plate.

• Thermal pad should be applied on NVME

• If device is intended to work at high ambient temperature it is advised to apply thermal gel between SODIMMs and RAM cover and thermal grease on top side of RAM cover

• The frame of the skirt is thermally coupled to the cold plate. Consider applying thermal paste on the frame of the skirt.

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Power Consumption

SmartShift Technology for Optimized Power Management

One of the key features of our System on Module, integrated with AMD Ryzen™ processors, is the SmartShift technology. This innovative feature allows for dynamic adjustment of power allocation between the CPU and other system components. By intelligently shifting power where it's needed most, SmartShift enhances overall performance and efficiency, making it an ideal solution for power-sensitive applications.

Controlling CPU Power Consumption

With SmartShift, you can precisely control the power consumption of the CPU, tailoring it to fit the specific needs of your application. This capability is especially beneficial in scenarios where power efficiency is crucial, such as in portable or battery-operated devices. You can set a limit to the CPU power consumption, for example, capping it at a specific wattage to balance performance with power usage.

Configuring CPU Power Limits in BIOS

To configure the CPU power limits, you can access the BIOS settings of our System on Module. We provide a detailed guide on how to navigate these settings and effectively set the desired power caps for your application.

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To demonstrate the efficacy and benefits of the SmartShift technology in our System on Module (SoM), extensive measurements have been conducted using a SoM based on the AMD Ryzen™ 7 7840HS processor paired with the Bedrock R7K Carrier Networking & I/O extension board (NIO). These tests were aimed at validating how effectively SmartShift manages power distribution under various operational conditions.

SmartShift Configuration Parameters:

The SmartShift feature is controlled through four key parameters in the BIOS Power tab, which allow for precise management of power distribution and consumption:

• APU Only sPPT Limit: Sets the peak power limit that the Accelerated Processing Unit (APU) can consume.

• Sustained Power Limit: Defines the sustained power threshold for long-term performance stability.

• Fast PPT Limit: Regulates the rapid power allowance for short bursts of intensive processing.

• Slow PPT Limit: Controls the lower power threshold, suitable for maintaining efficiency during less demanding tasks.

Measurement Results

The following table illustrates the power consumption results (in Watts) observed under various settings of these parameters. These measurements provide clear insights into how SmartShift adjusts power usage dynamically, ensuring optimal performance and efficiency across different workloads and operational states.

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Power Input

The recommended input range for the SoM is 12V-24V.

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SolidRun uses Molex 1053071202 Connector to interface between the SoM power input and the Phoenix Connecter.

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Flashing BIOS and MPS Power Controller
(Soon)

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Interface Allocation Spreadsheet

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