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Introduction

Welcome to our comprehensive user manual designed to assist you in developing a custom carrier board for use with our cutting-edge System on Module (SoM), which incorporates one of several high-performance AMD Ryzen™ processors. This manual is tailored specifically for hardware engineers looking to leverage the robust capabilities of the following AMD Ryzen™ processor models in their designs:

• AMD Ryzen™ 7 Pro 8845HS New

• AMD Ryzen™ 7 Pro 8840U New

Ryzen Embedded 8000 Series - Product Stack

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Our SoM offers a versatile foundation for a wide array of applications, from complex industrial PCs to sophisticated multimedia systems. By selecting our module, you will benefit from the remarkable performance, efficiency, and integrated features of AMD Ryzen™ processors, coupled with the flexibility and scalability essential for modern electronic design.

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Thank you for choosing our technology. We look forward to seeing the exceptional solutions you will build.

SOM R7000 / SOM R8000 - Block Diagram

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• Memory: DDR5 Dual 64BG Channels, Support Up to DDR5-5600.

• USB:
  2x USB4 (40 Gbps) - Supports USB-C Alt-Mode.
  2x USB 3.2 Gen2 (10 Gbps).
  4x USB2.0

• Display:
  • DisplayPort 0 (DP0) : eDP/DP/HDMI
  • DisplayPort 1 (DP1) : eDP/DP/HDMI
  • DisplayPort 2 (DP2, USBC0) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 3 (DP3, USBC1) : DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 4 (DP4, USBC4) : DP/HDMI; or USB-C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

AMD Ryzen™ 8040 Series Processors

We are excited to announce that AMD has recently launched the new Ryzen™ 8040 Series processors, representing the latest advancement in their mobile PC processor technology. As a pioneer in the industry, SolidRun is proud to be the first to integrate this cutting-edge processor series into a fanless industrial PC. This milestone underscores our commitment to leading the market by adopting innovative technologies that enhance the performance and reliability of our products.

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1. AI Processing Power: The 8040 Series features an integrated Neural Processing Unit (NPU) on select models which offers up to 1.6 times more AI processing performance compared to the previous models. This enhancement enables larger AI model handling directly on the device, facilitating more complex and real-time AI user experiences​.

2. Processor Architecture and Performance: Built on the AMD "Zen 4" architecture, the 8040 Series processors can have up to eight cores, capable of delivering up to 16 threads of processing power. Notable models like the Ryzen 9 8945HS provide significantly enhanced performance metrics—up to 64% faster video editing and up to 37% faster 3D rendering compared to competitors. These processors also feature advanced RDNA 3 architecture-based Radeon graphics for superior gaming and creative performance​.

3. Power Efficiency and Support for Advanced Memory: The 8040 Series supports advanced LPDDR5 memory, which contributes to its ability to manage high-demand applications more efficiently while also ensuring longer battery life through innovative power management features. This is especially beneficial for ultrathin laptops where power efficiency is crucial​.

4. Enhanced Connectivity and Features: These processors are designed to leverage the full range of the Windows 11 ecosystem for optimized performance, including comprehensive support for the latest security features and AI-enhanced applications provided by Windows. Features like background blur, eye gaze tracking, and noise cancellation are now accessible out-of-the-box on systems with these processors.

5. Software Ecosystem and Developer Support: AMD has also introduced Ryzen AI 1.0 Software alongside the 8040 Series. This software stack makes it easier for developers to deploy machine learning models trained in frameworks like PyTorch or TensorFlow, which can run efficiently on these processors​.

Mechanical Files

SoM Board Dimensions: 83 x 75.76 mm (Top View):

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Bedrock R7K/R8K SoM - Assembly Files.zip
Bedrock R7K/R8K SoM - Mechanical Files.zip

Carrier Board Example - Bedrock R7000

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Bedrock Cartridge

The Block Diagram above relates to SolidRun Bedrock R7000 Carrier Board which is called NIO (Networking and I/O board).

As part of developing a Custom Carrier board for the Bedrock  SoM, it’s recommended to take a look at the Bedrock Cartridge which is designed and used in our Bedrock R7000 product.

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HeatPlate Screws

In addition to our advanced thermal solutions, we are excited to offer a proprietary development in hardware assembly — specialized nuts (SolidRun P/N: MCH00462) designed specifically for securing the heatplate to the CPU in our System on Module (SoM). These nuts have been engineered for optimal thermal contact and mechanical stability, ensuring that the heatplate remains effectively and securely attached, enhancing overall thermal management. We make these specialized screws available for purchase alongside our SoM, providing a comprehensive solution for high-performance and reliability.

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Side view of the heat-plate + 4 nuts (MCH00462): 

Carrier B-t-B Connectors - MFG P/N

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Note: Top Side of SoM is placed on Top Side of NIO (Carrier), where the two boards are flipped one towards the other.

B-t-B Connectors Pin-out - Bedrock R7000 Carrier

The following is an example of the B2B pinout in Bedrock R7000 Carrier.
Please note that the pinout relates to the female connectors on a carrier, to which the Bedrock SoM male Connectors are inserted, and here we gave an example for SolidRun NIO Carrier Connectors (J4, J5, J6, J7). It’s important to be careful which pin is number #1.

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OrCad Symbols

In the following link you will find a PDF and OrCad Symbols for the Carrier BtB (Female) connectors, to which the SoM (Male) Connectors are inserted: 

1. Carrier BtB Connectors - PDF

2. Carrier BtB Connectors - OrCad Symbols

Differential Signals Impedance

In this Excel, you will find a list for the impedance for each differential signal. 

Note: All differential pairs are 90-Ohm, the rest are GPIOs/Single-Ended signals which are 50-Ohm by default.

Thermal Dissipation

• Thermal grease on Cartrridge:
  We apply thermal grease on certain spots in the Cartridge in order to cool down certain parts on the SoM, such as Inductors and ICs. we recommend placing the thermal grease (white) in the following places:
  

  

• Thermal paste on HeatSink and Thermal Pad on NVME:

  The following bottom view of the SoM shows the recommended places for placing thermal paste (on the SoM’s heatsink (gray), in addition to thermal pad on the NVME (blue):

  

• Liquid Metal:
  In SolidRun’s continuous efforts to optimize the performance and reliability of our System on Module (SoM), we have integrated an advanced thermal management solution. This feature employs a specialized liquid metal compound applied directly to the CPU, significantly enhancing thermal dissipation efficiency. While the specifics of this liquid metal technology are proprietary and cannot be disclosed publicly, we are pleased to offer it as a standard part of our SoM. This approach ensures that our customers benefit from reduced thermal constraints and improved performance without the need for separate implementation or additional thermal management strategies.

Power Consumption

SmartShift Technology for Optimized Power Management

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Power Input

The recommended input range for the SoM is 12V-24V.
Note: there is no reverse polarity protection on the SoM, please be careful not to confuse between the “+” and “-” signs. (Red is Positive “+”, Black is Negative “-”)

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SolidRun uses Molex 1053071202 Connector to interface between the SoM power input and the Phoenix Connecter.

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Flashing BIOS and MPS Power Controller
(Soon)

Interface Allocation Spreadsheet

Make a copy of Bedrock Interface Allocation Spreadsheet and see an actual example of Bedrock SoM Interfaces.
The specific implementation in the spreadsheet relates to the Bedrock R7000 Basic product.
Feel free to add/delete columns in order to match the implementation to your own custom carrier board.