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Introduction

Welcome to our comprehensive user manual designed to assist you in developing a custom carrier board for use with our cutting-edge System on Module (SoM), which incorporates one of several high-performance AMD Ryzen™ processors. This manual is tailored specifically for hardware engineers looking to leverage the robust capabilities of the following AMD Ryzen™ processor models in their designs:

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• Memory: DDR5 Dual 64BG Channels, Support Up to DDR5-5600.

• USB:
  2x USB4 (40 Gbps) - Supports USB-C Alt-Mode.
  2x USB 3.2 Gen2 (10 Gbps).
  4x USB2.0

• Display:
  • DisplayPort 0 (DP0) : eDP/DP/HDMI
  • DisplayPort 1 (DP1) : eDP/DP/HDMI
  • DisplayPort 2 (DP2, USBC0) : DP/HDMI; or USB-C® with DP alt mode; or USB4
  • DisplayPort 3 (DP3, USBC1): DP/HDMI; or USB-C with DP alt mode; or USB4
  • DisplayPort 4 (DP4, USBC4) : DP/HDMI; or USB-C with DP alt mode
  Note: Maximum 4 displays can be outputted simultaneously.

• PCIe: 9 ports, 16 Lanes PCIe Gen 4.

• Power: DC 12V-24V.

• Dimentions (83 mm x 91 mm x 12.7 mm) - Including SODIMM Modules.

• UART: 4 Ports.

• SPI: Yes.

• eSPI: Yes.

• I2C: 2 Ports.

• BIOS: AMI Aptio V

Mechanical Files

SoM Board Dimensions: 83 x 75.76 mm (Top View):

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Bedrock R7K/R8K SoM - Assembly Files.zip
Bedrock R7K/R8K SoM - Mechanical Files.zip

Carrier Board Example - Bedrock R7000/R8000

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Bedrock Cartridge

The Block Diagram above relates to SolidRun Bedrock R7000 Carrier Board which is called NIO (Networking and I/O board).

As part of developing a Custom Carrier board for the Bedrock  SoM, it’s recommended to take a look at the Bedrock Cartridge which is designed and used in our Bedrock R7000 product.

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HeatPlate Screws

In addition to our advanced thermal solutions, we are excited to offer a proprietary development in hardware assembly — specialized nuts (SolidRun P/N: MCH00462) designed specifically for securing the heatplate to the CPU in our System on Module (SoM). These nuts have been engineered for optimal thermal contact and mechanical stability, ensuring that the heatplate remains effectively and securely attached, enhancing overall thermal management. We make these specialized screws available for purchase alongside our SoM, providing a comprehensive solution for high-performance and reliability.

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Side view of the heat-plate + 4 nuts (MCH00462): 

Carrier B-t-B Connectors - MFG P/N

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Note: Top Side of SoM is placed on Top Side of NIO (Carrier), where the two boards are flipped one towards the other.

B-t-B Connectors - Example with Bedrock R7K Carrier (NIO)

Please note that the pinout relates to the female connectors on a carrier, to which the Bedrock SoM male Connectors are inserted, and here we gave an example for SolidRun NIO Carrier Connectors (J4, J5, J6, J7). It’s important to be careful which pin is number #1.

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OrCad Symbols

In the following link you will find a PDF and OrCad Symbols for the Carrier BtB (Female) connectors, to which the SoM (Male) Connectors are inserted: 

1. Carrier BtB Connectors - PDF

2. Carrier BtB Connectors - OrCad Symbols

Differential Signals Impedance

In this Excel, you will find a list for the impedance for each differential signal. 

Note: All differential pairs are 90-Ohm, the rest are GPIOs/Single-Ended signals which are 50-Ohm by default.

Thermal Dissipation

• Thermal grease on Cartrridge:
  We apply thermal grease on certain spots in the Cartridge in order to cool down certain parts on the SoM, such as Inductors and ICs. we recommend placing the thermal grease (white) in the following places:
  

  

• Thermal paste on HeatSink and Thermal Pad on NVME:

  The following bottom view of the SoM shows the recommended places for placing thermal paste (on the SoM’s heatsink (gray), in addition to thermal pad on the NVME (blue):

  

• Liquid Metal:
  In SolidRun’s continuous efforts to optimize the performance and reliability of our System on Module (SoM), we have integrated an advanced thermal management solution. This feature employs a specialized liquid metal compound applied directly to the CPU, significantly enhancing thermal dissipation efficiency. While the specifics of this liquid metal technology are proprietary and cannot be disclosed publicly, we are pleased to offer it as a standard part of our SoM. This approach ensures that our customers benefit from reduced thermal constraints and improved performance without the need for separate implementation or additional thermal management strategies.

Power Consumption

SmartShift Technology for Optimized Power Management

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Power Input

The recommended input range for the SoM is 12V-24V.
Note: there is no reverse polarity protection on the SoM, please be careful not to confuse between the “+” and “-” signs. (Red is Positive “+”, Black is Negative “-”)

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SolidRun uses Molex 1053071202 Connector to interface between the SoM power input and the Phoenix Connecter.

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Flashing BIOS and MPS Power Controller
(Soon)

Interface Allocation Spreadsheet

Make a copy of Bedrock Interface Allocation Spreadsheet and see an actual example of Bedrock SoM Interfaces.
The specific implementation in the spreadsheet relates to the Bedrock R7000 Basic product.
Feel free to add/delete columns in order to match the implementation to your own custom carrier board.