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Highly effective 1st stage thermal coupling (TIM0) to the Ryzen die to a copper heatplate.
Coupling the heatplate to a heatsink/cold-plate is easy. Coupling the die is challenging.Provision for mounting NIO securely with accurate spacing.
Easy mounting of SOM to enclosure / heatsink / cold-plate.This is challenging without the cartridge since SOM does not have mounting holes.
Thermal coupling for SOM’s DC-to-DC converters
Mounting of NVME SSD
Not present on SOM itselfSecuring and thermal coupling for SODIMMs
RTC battery compartment
Physical protection and rigidity to the SOM
Rigid chassis for the Bedrock Deck with multiple threaded mounting holes
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Bedrock SOM
If you decide to design directly with Bedrock SOM, it is advised to use Bedrock Cartridge as reference.
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